LCMXO3LF-6900C-6BG324C

LCMXO3LF-6900C-6BG324C is an ultra low density MachXO3 FPGA flash. It supports the most advanced programmable bridging and I/O expansion. It has the breakthrough I/O density and the lowest cost per I/O. The device I/O features have the integrated support for latest industry standard I/O. In addition to LUT-based, low-cost programmable logic this device features EBR, Distributed RAM, Phase Locked Loops (PLLs), pre-engineered source synchronous I/O support, advanced configuration support including dual-boot capability and hardened versions of commonly used functions such as SPI controller, I²C controller and timer/counter. It also supports UFM. Its features allow this device to be used in low-cost, high-volume applications such as consumer electronics, compute and storage, wireless communications, industrial control, and automotive systems.

• 6864 LUTs, 2.5V/3.3V supply voltage, 6 fastest speed
• Smallest footprint, lowest power, high data throughput bridging solutions for mobile applications
• Optimized footprint, logic density, I/O count, I/O performance device
• High I/O logic, lowest cost I/O, high I/O devices for I/O expansion applications
• DDR registers in I/O cells, dedicated gearing logic, 7:1 gearing for display I/O
• High performance, flexible I/O buffer, ideal for I/O bridging application, I/O support hot socketing
• Junction commercial operation temperature range from 0 to 85°C
• On-chip differential termination, programmable pull-up or pull-down mode
• Flexible on-chip clocking, TransFR reconfiguration
• 324 lead caBGA package, commercial operation junction temperature range from 0 to 85°C