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ManufacturerMICRON
Manufacturer Part NoMT53E1G16D1FW-046 WT:A
Newark Part No.80AH8269
Technical Datasheet
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Quantity | Price |
---|---|
1+ | $24.010 |
5+ | $23.120 |
10+ | $22.230 |
25+ | $21.920 |
50+ | $20.450 |
100+ | $19.480 |
250+ | $19.130 |
Price for:Each
Minimum: 1
Multiple: 1
$24.01
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT53E1G16D1FW-046 WT:A
Newark Part No.80AH8269
Technical Datasheet
DRAM TypeMobile LPDDR4
DRAM Density16Gbit
Memory Density16Gbit
DRAM Memory Configuration1G x 16bit
Memory Configuration1G x 16bit
Clock Frequency Max2.133GHz
Clock Frequency2.133GHz
Memory Case StyleTFBGA
IC Case / PackageTFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
Access Time-
IC MountingSurface Mount
Operating Temperature Min-25°C
Operating Temperature Max85°C
Product Range-
Product Overview
MT53E1G16D1FW-046 WT:A is a mobile LPDDR4 SDRAM. The low-power DDR4 SDRAM (LPDDR4) is a high-speed, CMOS dynamic random-access memory device. This 8-bank device is internally configured with ×16 I/O. Each of the ×16 2,147,483,648-bit banks are organized as 131,072 rows by 1024 columns by 16 bits. LPDDR4 uses a double-data-rate (DDR) protocol on the DQ bus to achieve high-speed operation. The DDR interface transfers two data bits to each DQ lane in one clock cycle and is matched to a 16n-prefetch DRAM architecture.
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), programmable and on-the-fly burst lengths (BL=16, 32)
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- On-chip temperature sensor to control self refresh rate
- Partial-array self refresh (PASR), selectable output drive strength (DS), clock-stop capability
- 2GB (16Gb) total density, 4266Mb/s data rate per pin
- 1.10V VDD2/0.60V or 1.10V VDDQ operating voltage
- 200-ball TFBGA package
- Operating temperature from -30°C to +85°C
Technical Specifications
DRAM Type
Mobile LPDDR4
Memory Density
16Gbit
Memory Configuration
1G x 16bit
Clock Frequency
2.133GHz
IC Case / Package
TFBGA
Supply Voltage Nom
1.1V
IC Mounting
Surface Mount
Operating Temperature Max
85°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
16Gbit
DRAM Memory Configuration
1G x 16bit
Clock Frequency Max
2.133GHz
Memory Case Style
TFBGA
No. of Pins
200Pins
Access Time
-
Operating Temperature Min
-25°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate