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ManufacturerMICRON
Manufacturer Part NoMT53E256M16D1FW-046 AUT:B
Newark Part No.80AH8357
Your Part Number
Technical Datasheet
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| Quantity | Price |
|---|---|
| 1+ | $36.780 |
Price for:Each
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Multiple: 1
$36.78
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT53E256M16D1FW-046 AUT:B
Newark Part No.80AH8357
Technical Datasheet
DRAM TypeMobile LPDDR4
Memory Density4Gbit
DRAM Density4Gbit
DRAM Memory Configuration256M x 16bit
Memory Configuration256M x 16bit
Clock Frequency Max2.133GHz
Clock Frequency2.133GHz
IC Case / PackageTFBGA
Memory Case StyleTFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
IC MountingSurface Mount
Access Time468ps
Operating Temperature Min-40°C
Operating Temperature Max125°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT53E256M16D1FW-046 AUT:B is a 4Gb mobile low-power DDR4 SDRAM with low VDDQ. It is a high-speed CMOS, dynamic random-access memory. This memory is internally configured with x16 I/O, 8-banks. Each of the x16’s 536,870,912-bit banks are organized as 32,768 rows by 1024 columns by 16bits. It has programmable VSS (ODT) termination and partial-array self refresh (PASR). This memory has on-chip temperature sensor to control self refresh rate and directed per-bank refresh for concurrent bank operation and ease of command scheduling.
- Operating voltage range is 1.10V (VDD2)/0.60V or 1.10V (VDDQ)
- 256Meg x 16 configuration, LPDDR4, 1die addressing
- Packaging style is 200-ball TFBGA
- Cycle time is 468ps at RL = 36/40
- Operating temperature range is –40°C to +125°C, E design, automotive qualified
- Clock rate is 2133MHz, data rate per pin is 4266Mb/s
- Ultra-low-voltage core and I/O power supplies
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), selectable output drive strength (DS)
Technical Specifications
DRAM Type
Mobile LPDDR4
DRAM Density
4Gbit
Memory Configuration
256M x 16bit
Clock Frequency
2.133GHz
Memory Case Style
TFBGA
Supply Voltage Nom
1.1V
Access Time
468ps
Operating Temperature Max
125°C
SVHC
No SVHC (17-Jan-2023)
Memory Density
4Gbit
DRAM Memory Configuration
256M x 16bit
Clock Frequency Max
2.133GHz
IC Case / Package
TFBGA
No. of Pins
200Pins
IC Mounting
Surface Mount
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:Unknown
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate