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ManufacturerMICRON
Manufacturer Part NoMT53E256M32D2FW-046 AAT:B
Newark Part No.80AH8370
Your Part Number
Technical Datasheet
Available to Order
Manufacturer Standard Lead Time: 41 week(s)
| Quantity | Price |
|---|---|
| 1+ | $68.680 |
Price for:Each
Minimum: 1360
Multiple: 1360
$93,404.80
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerMICRON
Manufacturer Part NoMT53E256M32D2FW-046 AAT:B
Newark Part No.80AH8370
Technical Datasheet
DRAM TypeMobile LPDDR4
DRAM Density8Gbit
Memory Density8Gbit
DRAM Memory Configuration256M x 32bit
Memory Configuration256M x 32bit
Clock Frequency Max2.133GHz
Clock Frequency2.133GHz
Memory Case StyleTFBGA
IC Case / PackageTFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
IC MountingSurface Mount
Access Time468ps
Operating Temperature Min-40°C
Operating Temperature Max105°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT53E256M32D2FW-046 AAT:B is a 4Gb mobile low-power DDR4 SDRAM with low VDDQ. It is a high-speed CMOS, dynamic random-access memory. This memory is internally configured with x16 I/O, 8-banks. Each of the x16’s 536,870,912-bit banks are organized as 32,768 rows by 1024 columns by 16bits. It has directed per-bank refresh for concurrent bank operation and ease of command scheduling. This memory has on-chip temperature sensor to control self refresh rate. It has clock-stop capability.
- Operating voltage range is 1.10V (VDD2)/0.60V or 1.10V (VDDQ)
- 256Meg x 32 configuration, LPDDR4, 2die addressing, B design
- Packaging style is 200-ball TFBGA
- Cycle time is 468ps at RL = 36/40, partial-array self refresh (PASR)
- Operating temperature range is –40°C to +105°C, automotive qualified
- Clock rate is 2133MHz, data rate per pin is 4266Mb/s
- Ultra-low-voltage core and I/O power supplies
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), selectable output drive strength (DS)
Technical Specifications
DRAM Type
Mobile LPDDR4
Memory Density
8Gbit
Memory Configuration
256M x 32bit
Clock Frequency
2.133GHz
IC Case / Package
TFBGA
Supply Voltage Nom
1.1V
Access Time
468ps
Operating Temperature Max
105°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
8Gbit
DRAM Memory Configuration
256M x 32bit
Clock Frequency Max
2.133GHz
Memory Case Style
TFBGA
No. of Pins
200Pins
IC Mounting
Surface Mount
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate