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ManufacturerMICRON
Manufacturer Part NoMT62F1G32D2DS-023 IT:B
Newark Part No.25AK7984
Technical Datasheet
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Multiple: 1
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F1G32D2DS-023 IT:B
Newark Part No.25AK7984
Technical Datasheet
DRAM TypeMobile LPDDR5
DRAM Density32Gbit
Memory Density32Gbit
Memory Configuration1G x 32bit
DRAM Memory Configuration1G x 32bit
Clock Frequency4.266GHz
Clock Frequency Max4.266GHz
Memory Case StyleTFBGA
IC Case / PackageTFBGA
No. of Pins315Pins
Supply Voltage Nom1.05V
Access Time234ps
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
- Y42M mobile LPDDR5 SDRAM
- 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1)
- Single x16 channel/die, double-data-rate command/address entry
- Differential data clocks (WCK_t/WCK_c), background ZQ calibration/command-based ZQ calibration
- Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
- I/O type: low-swing single-ended, VSS terminated, VOH-compensated output drive
- Dynamic voltage frequency scaling core, single-ended CK, single-ended WCK and single-ended RDQS
- Operating voltage is 1.05V VDD2/0.5V VDDQ
- 1 Gig x 32 configuration
- 315-ball TFBGA package, -40°C to +95°C operating temperature
Technical Specifications
DRAM Type
Mobile LPDDR5
Memory Density
32Gbit
DRAM Memory Configuration
1G x 32bit
Clock Frequency Max
4.266GHz
IC Case / Package
TFBGA
Supply Voltage Nom
1.05V
IC Mounting
Surface Mount
Operating Temperature Max
95°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
32Gbit
Memory Configuration
1G x 32bit
Clock Frequency
4.266GHz
Memory Case Style
TFBGA
No. of Pins
315Pins
Access Time
234ps
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate