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MT62F1G32D2DS-026 WT:C
DRAM, Mobile LPDDR5, 32 Gbit, 1G x 32bit, 3.75 GHz, TFBGA, 315 Pins
Image is for illustrative purposes only. Please refer to product description.
ManufacturerMICRON
Manufacturer Part NoMT62F1G32D2DS-026 WT:C
Newark Part No.48AK5458
Technical Datasheet
Available to Order
Manufacturer Standard Lead Time: 24 week(s)
| Quantity | Price |
|---|---|
| 250+ | $45.370 |
Price for:Each
Minimum: 1050
Multiple: 1050
$47,638.50
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F1G32D2DS-026 WT:C
Newark Part No.48AK5458
Technical Datasheet
DRAM TypeMobile LPDDR5
DRAM Density32Gbit
Memory Density32Gbit
DRAM Memory Configuration1G x 32bit
Memory Configuration1G x 32bit
Clock Frequency3.75GHz
Clock Frequency Max3.75GHz
IC Case / PackageTFBGA
Memory Case StyleTFBGA
No. of Pins315Pins
Supply Voltage Nom1.05V
IC MountingSurface Mount
Access Time266ps
Operating Temperature Min-25°C
Operating Temperature Max85°C
Product Range-
Product Overview
MT62F1G32D2DS-026 WT:C is a mobile LPDDR5 SDRAM.
- Architecture: 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1)
- Frequency range: 1067–5MHz (data rate range per pin: 8533–40Mb/s with WCK:CK = 4:1)
- Data interface: single x16 channel/die, double-data-rate command/address entry
- Differential command clocks (CK-t/CK-c) for high-speed operation, differential data clocks
- 16n-bit or 32n-bit prefetch architecture
- Bank architecture: 8-bank (8B) mode, bank group (BG) mode, and 16-bank (16B) mode supported
- Command-selectable burst lengths (BL = 16 or 32) in bank group or 16-bank modes
- Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
- 4GB (32Gb) total density, 7500Mb/s data rate per pin
- 315-ball TFBGA package, -25°C ≤ Tc ≤ +85°C operating temperature
Technical Specifications
DRAM Type
Mobile LPDDR5
Memory Density
32Gbit
Memory Configuration
1G x 32bit
Clock Frequency Max
3.75GHz
Memory Case Style
TFBGA
Supply Voltage Nom
1.05V
Access Time
266ps
Operating Temperature Max
85°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
32Gbit
DRAM Memory Configuration
1G x 32bit
Clock Frequency
3.75GHz
IC Case / Package
TFBGA
No. of Pins
315Pins
IC Mounting
Surface Mount
Operating Temperature Min
-25°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:Unknown
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate