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ManufacturerMICRON
Manufacturer Part NoMT62F768M64D4EK-023 WT:B
Newark Part No.25AK8037
Technical Datasheet
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F768M64D4EK-023 WT:B
Newark Part No.25AK8037
Technical Datasheet
DRAM TypeLPDDR5
DRAM Density48Gbit
Memory Density48Gbit
Memory Configuration768M x 64bit
DRAM Memory Configuration768M x 64bit
Clock Frequency Max5MHz
Clock Frequency5MHz
IC Case / PackageTFBGA
Memory Case StyleTFBGA
No. of Pins441Pins
Supply Voltage Nom1.05V
IC MountingSurface Mount
Access Time234ps
Operating Temperature Min-25°C
Operating Temperature Max85°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
- MT62F768M64D4 mobile LPDDR5 SDRAM
- Operating voltage range from 1.05V VDD2/0.5V VDDQ, 768 Meg x 64 configuration
- LPDDR5/LPDDR5X, 4 die count, 234ps WCK cycle time
- Architecture-17.1GB/s maximum bandwidth per channel, single x16 channel/die
- Double-data-rate command/address entry, differential command clocks for high-speed operation
- Command-selectable burst lengths (BL = 16 or 32) in bank group or 16-bank modes
- Background ZQ calibration/command-based ZQ calibration
- Optional link protection (link ECC)
- 441-ball TFBGA package, operating temperature range from –25°C ≤ TC ≤ +85°C
- Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
Technical Specifications
DRAM Type
LPDDR5
Memory Density
48Gbit
DRAM Memory Configuration
768M x 64bit
Clock Frequency
5MHz
Memory Case Style
TFBGA
Supply Voltage Nom
1.05V
Access Time
234ps
Operating Temperature Max
85°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
48Gbit
Memory Configuration
768M x 64bit
Clock Frequency Max
5MHz
IC Case / Package
TFBGA
No. of Pins
441Pins
IC Mounting
Surface Mount
Operating Temperature Min
-25°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate