130-D

The 130-D is a Compression Mounting Clamp Assembly for semiconductors to 2.25-inch (57.2mm) diameter. The 130 series clamp systems provide electrical and industrial equipment manufacturers with complete system solutions for proper installation and heat dissipation for high-power compression pack semiconductor. The high-quality mounting clamp assemblies are the worldwide standard for mounting, compression and clamping press-pack SCR, thyristor, rectifier and other high power disc packaged devices utilized in power distribution equipment, industrial controls, transportation systems and power supply and conversion systems.

• Crossbar device mounting
• Surface to spring assembly
• 800 to 2000lbs (362.9 to 907.2kg) Maximum clamping force

Applications

Thermal Management, Industrial