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ManufacturerMICRON
Manufacturer Part NoMT53E128M32D2FW-046 IT:A
Newark Part No.80AH8321
Technical Datasheet
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT53E128M32D2FW-046 IT:A
Newark Part No.80AH8321
Technical Datasheet
DRAM TypeMobile LPDDR4
DRAM Density4Gbit
Memory Density4Gbit
DRAM Memory Configuration128M x 32bit
Memory Configuration128M x 32bit
Clock Frequency2.133GHz
Clock Frequency Max2.133GHz
Memory Case StyleTFBGA
IC Case / PackageTFBGA
No. of Pins200Pins
Supply Voltage Nom1.1V
Access Time-
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
MT53E128M32D2FW-046 IT:A is a mobile LPDDR4 SDRAM. The low-power DDR4 SDRAM (LPDDR4) or low VDDQ (LPDDR4X) is a high-speed CMOS, dynamic random-access memory. The device is internally configured with x16 channel, each channel has8-banks. LPDDR4 uses a double-data-rate (DDR) protocol on the DQ bus to achieve high-speed operation. The DDR interface transfers two data bits to each DQ lane in one clock cycle and is matched to a 16n-prefetch DRAM architecture.
- 16n prefetch DDR architecture, 8 internal banks per channel for concurrent operation
- Single-data-rate CMD/ADR entry, bidirectional/differential data strobe per byte lane
- Programmable READ and WRITE latencies (RL/WL), programmable and on-the-fly burst lengths (BL=16, 32)
- Directed per-bank refresh for concurrent bank operation and ease of command scheduling
- On-chip temperature sensor to control self refresh rate
- Partial-array self refresh (PASR), selectable output drive strength (DS), clock-stop capability
- 2133MHz clock rate, 4266Mb/s/pin data rate
- 4Gb total density, 1.10V VDD2/0.60V or 1.10V VDDQ operating voltage
- 128 Meg x 32 configuration
- 200-ball TFBGA package, -40°C to +95°C operating temperature
Technical Specifications
DRAM Type
Mobile LPDDR4
Memory Density
4Gbit
Memory Configuration
128M x 32bit
Clock Frequency Max
2.133GHz
IC Case / Package
TFBGA
Supply Voltage Nom
1.1V
IC Mounting
Surface Mount
Operating Temperature Max
95°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
4Gbit
DRAM Memory Configuration
128M x 32bit
Clock Frequency
2.133GHz
Memory Case Style
TFBGA
No. of Pins
200Pins
Access Time
-
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:Unknown
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate