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MT62F768M32D2DS-023 AIT:C
DRAM, AEC-Q100, Mobile LPDDR5, 24 Gbit, 768M x 32bit, 4.266 GHz, TFBGA, 315 Pins
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| Quantity | Price |
|---|---|
| 1+ | $27.380 |
| 5+ | $27.380 |
| 10+ | $27.380 |
| 25+ | $27.380 |
| 50+ | $27.380 |
| 100+ | $27.380 |
| 250+ | $27.380 |
Price for:Each
Minimum: 1
Multiple: 1
$27.38
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F768M32D2DS-023 AIT:C
Newark Part No.72AK6866
DRAM TypeMobile LPDDR5
Memory Density24Gbit
Memory Configuration768M x 32bit
Clock Frequency Max4.266GHz
IC Case / PackageTFBGA
No. of Pins315Pins
Supply Voltage Nom1.05V
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Dec-2015)
Product Overview
- Mobile LPDDR5/LPDDR5X SDRAM
- 1.05V VDD2H / 0.5V VDDQ operating voltage, 768 Meg x 32 configuration
- 2 die count, 234ps, tWCK cycle time, automotive grade
- Single x16 channel/die, double-data-rate command/address entry
- Differential command clocks (CK-t/CK-c) for high-speed operation
- Differential data clocks (WCK-t/WCK-c), differential read strobe (RDQS-t/RDQS-c)
- Programmable VSS on-die termination (ODT), non target ODT support
- Single-ended CK, single-ended WCK, and single-ended RDQ
- Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
- Operating temperature range from -40°C to +95°C, package style is 315-ball TFBGA
Technical Specifications
DRAM Type
Mobile LPDDR5
Memory Configuration
768M x 32bit
IC Case / Package
TFBGA
Supply Voltage Nom
1.05V
Operating Temperature Min
-40°C
Product Range
-
Memory Density
24Gbit
Clock Frequency Max
4.266GHz
No. of Pins
315Pins
IC Mounting
Surface Mount
Operating Temperature Max
95°C
SVHC
No SVHC (17-Dec-2015)
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Dec-2015)
Download Product Compliance Certificate
Product Compliance Certificate