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OM13491UL
Breakout Board, 8-HWSON x 2, 8-MSOP x 2, 8-VSSOP, 8-XQFN, 8-SOIC/DIP, 0.1" Pitch Spacing
Image is for illustrative purposes only. Please refer to product description.
Available to Order
Manufacturer Standard Lead Time: 8 week(s)
| Quantity | Price |
|---|---|
| 1+ | $28.750 |
Price for:Each
Minimum: 1
Multiple: 1
$28.75
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Product Information
ManufacturerNXP
Manufacturer Part NoOM13491UL
Newark Part No.44AC0512
Technical Datasheet
Convert From8-HWSON x 2 / MSOP x 2 / VSSOP / XQFN / SOIC
Convert ToDIP
Pitch Spacing2.54mm
Row Pitch-
Product Range-
SVHCNo SVHC (27-Jun-2024)
Product Overview
OM13491UL is a surface mount to DIP evaluation board. The OM13491 allows one to evaluate small, surface mount devices by breaking out the package leads to 100mil centers pins, emulating a DIP package. The OM13491 supports the following packages such as SO8 (SOT96), VSSOP8 (SOT765), XQFN8 (SOT902), HWSON8 x 2 (SOT1069), MSOP8 x 2 (SOT505).
- Easy connection to small surface mount packages
- Allows evaluation of device that is only available in surface mount packages
- 100mil center headers emulate DIP package for easy bread boarding
- Eliminates costly sockets and custom printed circuit boards
- Expand the kit with add-on I2C daughter cards
- Supported devices: GTL2012DP (2bit LVTTL-to-GTL transceiver)
- Supported devices: PCA9306 dual bidirectional I2C-bus and SMBus voltage level translator
- Supported devices: SE97BTP DDR memory module temp sensor with integrated SPD
Technical Specifications
Convert From
8-HWSON x 2 / MSOP x 2 / VSSOP / XQFN / SOIC
Pitch Spacing
2.54mm
Product Range
-
Convert To
DIP
Row Pitch
-
SVHC
No SVHC (27-Jun-2024)
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (27-Jun-2024)
Download Product Compliance Certificate
Product Compliance Certificate