Print Page
OM13497UL
Breakout Board, 24-HTSSOP, 24-VFBGA, 24-XFBGA/DIP, 0.1" Pitch Spacing
Image is for illustrative purposes only. Please refer to product description.
Available to Order
Manufacturer Standard Lead Time: 8 week(s)
| Quantity | Price |
|---|---|
| 1+ | $28.750 |
Price for:Each
Minimum: 1
Multiple: 1
$28.75
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
This number will be added to the Order Confirmation, Invoice, Dispatch note, Web confirmation Email and Product Label.
Product Information
ManufacturerNXP
Manufacturer Part NoOM13497UL
Newark Part No.44AC0518
Technical Datasheet
Convert From24-HTSSOP / VFBGA / XFBGA
Convert ToDIP
Pitch Spacing2.54mm
Row Pitch-
Product Range-
SVHCNo SVHC (27-Jun-2024)
Product Overview
OM13497UL is a surface mount to DIP evaluation board. The OM13497 allows one to evaluate small, surface mount devices by breaking out the package leads to 100mil centers pins, emulating a DIP package. The OM13497 supports the following packages such as VFBGA24 (SOT1199-1), XFBGA24 (SOT1342-1), HTSSOP24 (SOT1172-2).
- Easy connection to small surface mount packages
- Allows evaluation of device that is only available in surface mount packages
- 100 mil center headers emulate DIP package for easy bread boarding
- Eliminates costly sockets and custom printed circuit boards
- Expand the kit with add-on I²C daughter cards
- Supported devices: PCAL6416AEX low-voltage translating 16bit I²C-Bus/SMBus I/O expander
- PCAL6416A low voltage translating 16bit I²C-Bus/SMBus I/O expander
- PCA9703 18V tolerant SPI 16bit GPI with maskable INT
Technical Specifications
Convert From
24-HTSSOP / VFBGA / XFBGA
Pitch Spacing
2.54mm
Product Range
-
Convert To
DIP
Row Pitch
-
SVHC
No SVHC (27-Jun-2024)
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (27-Jun-2024)
Download Product Compliance Certificate
Product Compliance Certificate