HPDC2512-100RFT4

HPDC series high power density chip resistors are ideally suited for handling by automatic methods due to their rectangular shape and small dimensional tolerances. Electrical connection to a ceramic substrate or to printed circuit board can be made by reflow or wave soldering of wrap-around terminations. Due to robust construction, HPDC can be immersed in solder bath for 30sec at 260°C. This enables resistor to be mounted on one side of a printed circuit board and wire-leaded components applied on the other side. These may also be used in temperature controlled heating applications in which the power applied is restricted only by maximum element temperature of 155°C and maximum termination temperature of 110°C. Wraparound terminations have an electro-plated nickel barrier and solderable coating. This ensures excellent leach resistance properties and solderability. Body protection is resistant to all normal industrial cleaning solvents suitable for printed circuits.

• Aluminum nitride (AlN) substrate
• Wide area solder termination
• Offers <gt/>3 x standard power density
• Operating temperature range from -55°C to +155°C
• Solvent resistant
• Thick film material, overglaze, organic protection screen printed on aluminum nitride substrate