C10-638974-000

The RADSOK series Power-to-board Connector facilitates the distribution of power with higher amperage, while allowing the design engineer to achieve size and weight reductions. High speed and density electronics have driven demand for significant increases in the amount of power needed for power to board applications. To meet the need for higher current density interconnects Amphenol Industrial Global Operations developed the RADSOK® Power to Board series of connectors. Conventional interconnects are limited in their ability to deliver high current without consuming excessive board surface area. The RADSOK® Power to Board series of connectors incorporates a hyperbolic lamella socket contact construction that provides more contact surface area. The high performance contact enables higher current carrying capabilities with lower temperature rises than traditional contact systems.

• High reliability
• Low contact engagement/separation forces
• Low contact resistance
• High mating cycle durability

Applications

Medical, Industrial, Automotive, Defence, Military & Aerospace, Mining, Oil & Gas