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GPVOUS-0.040-00-0816
Gap Filler, Filled Silicone Polymer, 1W/m.K, Gap Pad Series, 406.4 mm x 203.2 mm x 1.016 mm
Image is for illustrative purposes only. Please refer to product description.
| Manufacturer | BERGQUIST |
|---|---|
| Manufacturer Part No | GPVOUS-0.040-00-0816Copy |
| Manufacturer Standard Lead Time | 22 weeks |
| Newark Part No. | 47T2096 |
| Product Range | GAP PAD TGP Series |
| Your Part Number | |
| Technical Datasheet |
52 In Stock
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Delivery in 4-6 Business Days(UK stock)
Order before 6pm EST standard shipping
| Quantity | Price |
|---|---|
| 1+ | $255.050 |
| 5+ | $233.350 |
| 10+ | $221.340 |
| 25+ | $206.820 |
| 50+ | $191.610 |
| 100+ | $178.340 |
| 10000+ | $174.770 |
Price for:Each
Minimum: 1
Multiple: 1
$255.05
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
| Manufacturer | BERGQUIST |
|---|---|
| Manufacturer Part No | GPVOUS-0.040-00-0816Copy |
| Manufacturer Standard Lead Time | 22 weeks |
| Newark Part No. | 47T2096 |
| Product Range | GAP PAD TGP Series |
| Technical Datasheet | |
| Thermal Conductivity | 1W/m.K |
| Conductive Material | Filled Silicone Polymer |
| Thickness | 1.016mm |
| Thermal Impedance | - |
| Dielectric Strength | - |
| External Length | 406.4mm |
| External Width | 203.2mm |
| Product Range | GAP PAD TGP Series |
| SVHC | No SVHC (25-Jun-2025) |
Product Overview
The GPVOUS-0.040-00-0816 is a 0.04 x 8 x 16-inch ultra-conformable Thermally Conductive Material for filling air gap. This mauve/pink material is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Gap Pad® VO Ultra Soft is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks, high-voltage and bare-leaded devices.
- UL94V-0 Flammability rating
- Highly conformable and low hardness
- Puncture, shear and tear-resistant
- Decreased strain
- Gel-like modulus
- Electrically isolating
Technical Specifications
| Thermal Conductivity | 1W/m.K |
|---|---|
| Thickness | 1.016mm |
| Dielectric Strength | - |
| External Width | 203.2mm |
| SVHC | No SVHC (25-Jun-2025) |
| Conductive Material | Filled Silicone Polymer |
|---|---|
| Thermal Impedance | - |
| External Length | 406.4mm |
| Product Range | GAP PAD TGP Series |
Technical Docs (2)
Legislation and Environmental
| US ECCN: | EAR99 |
|---|---|
| EU ECCN: | Unknown |
| RoHS Compliant: | Yes RoHS |
| RoHS Phthalates Compliant: | To be advised |
| SVHC: | No SVHC (25-Jun-2025) |
| Download Product Compliance Certificate | Product Compliance Certificate |