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K10-104
Thermal Insulator, Thermal Pad, TO-3P, PI (Polyimide) Film, 1.3 W/m.K, 6 kV, 0.152 mm, 10 ohm-m
Image is for illustrative purposes only. Please refer to product description.
| Manufacturer | BERGQUIST |
|---|---|
| Manufacturer Part No | K10-104Copy |
| Manufacturer Standard Lead Time | 22 weeks |
| Newark Part No. | 70C9348 |
| Product Range | SIL PAD TSP Series |
| Your Part Number | |
| Technical Datasheet |
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| Quantity | Price |
|---|---|
| 1+ | $1.860 |
| 10+ | $1.730 |
| 25+ | $1.620 |
| 50+ | $1.530 |
| 100+ | $1.380 |
| 250+ | $1.270 |
| 500+ | $1.110 |
| 1000+ | $0.993 |
Price for:Each
Minimum: 1
Multiple: 1
$1.86
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
| Manufacturer | BERGQUIST |
|---|---|
| Manufacturer Part No | K10-104Copy |
| Manufacturer Standard Lead Time | 22 weeks |
| Newark Part No. | 70C9348 |
| Product Range | SIL PAD TSP Series |
| Technical Datasheet | |
| Insulator Body Material | PI (Polyimide) Film |
| Thermal Conductivity | 1.3W/m.K |
| Breakdown Voltage Vbr | 6kV |
| Thickness | 0.152mm |
| Volume Resistivity | 10ohm-m |
| Thermal Impedance | 0.86°C/W |
| Dielectric Strength | - |
| Product Range | SIL PAD TSP Series |
| SVHC | No SVHC (25-Jun-2025) |
Product Overview
Sil-Pad K-10 is a high performance insulator. It combines special film with a filled silicone rubber. The result is a product with good cut-through properties and excellent thermal performance. Sil-Pad K-10 is designed to replace ceramic insulators such as Beryllium Oxide, Boron Nitride, and Alumina. These insulators are expensive and they break easily. Sil-Pad K-10 eliminates breakage and costs much less than ceramics.
- Thermal impedance 0.41°C-in2/W (@50 psi)
- 0.2℃/W thermal resistance
- Tough dielectric barrier against cut-through
- Electrically isolating to 6kV (min)
- High performance film
- Designed to replace ceramic insulators
Technical Specifications
| Insulator Body Material | PI (Polyimide) Film |
|---|---|
| Breakdown Voltage Vbr | 6kV |
| Volume Resistivity | 10ohm-m |
| Dielectric Strength | - |
| SVHC | No SVHC (25-Jun-2025) |
| Thermal Conductivity | 1.3W/m.K |
|---|---|
| Thickness | 0.152mm |
| Thermal Impedance | 0.86°C/W |
| Product Range | SIL PAD TSP Series |
Technical Docs (2)
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Legislation and Environmental
| US ECCN: | EAR99 |
|---|---|
| EU ECCN: | Unknown |
| RoHS Compliant: | Yes RoHS |
| RoHS Phthalates Compliant: | To be advised |
| SVHC: | No SVHC (25-Jun-2025) |
| Download Product Compliance Certificate | Product Compliance Certificate |