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Desoldering Braid, Soder-Wick Series, Blue, Copper, 2.8 mm Width, 7.5 m Length


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Manufacturer Part No:
Newark Part No.:
Product Range
Soder-Wick Series
Technical Datasheet:
50-4-25   Datasheet
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Technical Documents (2)

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CAD Models and drawings are provided to you on a revocable limited licence for your internal use only but remain the property of the manufacturer who retain all intellectual property rights and ownership. They are provided to assist you in decision making and as design guide but are not guaranteed to be error free, accurate or up to date and is not intended to be taken as advice.
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Product Overview

The 50-4-25 from Chemtronics is a Soder-Wick rosin desoldering braid in 1 spool. This Soder-Wick offers the state of the art in desoldering technology. It is designed for today’s heat sensitive electronic components using lighter mass, pure copper braid construction that allows for better thermal conductivity, even at low temperatures. Soder-Wick responds faster than conventional desoldering braids thereby minimizing overheating and preventing PCB damage. Soder-Wick rosin safely removes solder in all applications requiring type ROL0 rosin flux, BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. It meets MIL-F-14256F, type R NASA-STD-8739.3, DOD-STD-883E, method 2022 ANSI/IPC J STD-004, type ROL0 Bellcore TR-NWT-000078, ANSI/IPC J SF-818, MIL-STD-2000A, MIL-B-81705C, MIL-STD-1686C and MIL-HDBK-263B standards.
  • 0.110"/2.8mm width, 25'/7.5m length
  • Rosin blue label on spool
  • Minimizes the risk of damage associated with static electricity
  • Noncorrosive ultra high purity type R rosin flux
  • Minimizes the risk of heat damage to the board
  • Will not leave ionic contamination on the boards
  • Shelf life of 2 years
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