DP270-BLACK-200ML

DP270-BLACK-200ML is a Scotch-Weld™ epoxy potting compound/adhesive. It is a two-part, low viscosity epoxy resin system designed primarily for potting, sealing, and encapsulation of many electronic components. It is noncorrosive to copper and offers good thermal shock resistance and excellent retention of electrical insulation properties under high humidity conditions. It has a work life of approximately 70minutes, a tack-free time of about 3hours and is fully cured after 48hours at 73°F (23°C). This product produces no exotherm in 5-10gram masses and a very slight exotherm in larger masses. It is ideal for the potting and encapsulation of many heat sensitive or delicate components such as glass diodes and sensors as well as for transformers, coils, chokes, relays, etc.

• Good thermal shock resistance
• Meets UL 94 HB (file no. E61941)
• Long work life, excellent electrical properties
• Noncorrosive to copper, negligible exotherm
• Color is black, epoxy/amine base resin
• 1:1 by volume (1:0.85 B:A by weight) mix ratio
• Work life is 60-70minutes at 23°C
• Viscosity at 23°C is 7000-16,000cps (base), 6000-12,000cps (accelerator)
• Dielectric strength (ASTM D-149) is 850volts/mil
• Volume resistivity (ASTM D-257) is 4.1 x 1014ohm-cm

Remarques

It is available in the convenient 3M™ EPX™ Applicator System for multi-station usage and in bulk containers for larger volume applications.