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FabricantMICRON
Réf. FabricantMT40A2G16TBB-062E:F
Code Commande32AK9418
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Informations produit
FabricantMICRON
Réf. FabricantMT40A2G16TBB-062E:F
Code Commande32AK9418
Fiche technique
DRAM TypeDDR4
DRAM Density32Gbit
Memory Density32Gbit
DRAM Memory Configuration2G x 16bit
Memory Configuration2G x 16bit
Clock Frequency Max1.6GHz
Clock Frequency1.6GHz
Memory Case StyleFBGA
IC Case / PackageFBGA
No. of Pins96Pins
Supply Voltage Nom1.2V
Access Time625ps
IC MountingSurface Mount
Operating Temperature Min0°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Dec-2015)
Aperçu du produit
MT40A2G16TBB-062E:F is a 32Gb (TwinDie™) DDR4 SDRAM. It uses micron’s 16Gb DDR4 SDRAM die and two x8s combined to make one x16. It uses similar signals as the mono x16, and there is one extra ZQ connection for faster ZQ calibration and a BG1 control required for x8 addressing.
- VDD = VDDQ is 1.2V (1.14–1.26V)
- 1.2V VDDQ-terminated I/O
- JEDEC-standard ball-out
- Operating temperature range is 0°C to 95°C
- 128Meg x 16 x 16banks x 1rank
- Timing cycle time is 1 0.625ns at CL = 22 (DDR4-3200)
- Data rate is 3200MT/s, low-profile package
- Package style is 96ball FBGA package 7.5mm x 13mm x 1.2mm
Spécifications techniques
DRAM Type
DDR4
Memory Density
32Gbit
Memory Configuration
2G x 16bit
Clock Frequency
1.6GHz
IC Case / Package
FBGA
Supply Voltage Nom
1.2V
IC Mounting
Surface Mount
Operating Temperature Max
95°C
SVHC
No SVHC (17-Dec-2015)
DRAM Density
32Gbit
DRAM Memory Configuration
2G x 16bit
Clock Frequency Max
1.6GHz
Memory Case Style
FBGA
No. of Pins
96Pins
Access Time
625ps
Operating Temperature Min
0°C
Product Range
-
Documents techniques (1)
Législation et Questions environnementales
US ECCN:3A991B1A
EU ECCN:Unknown
Conforme RoHS :Oui
RoHS
Conforme à la norme RoHS Phthalates:Oui
RoHS
SVHC :No SVHC (17-Dec-2015)
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Certificat de conformité du produit