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| Quantity | Price |
|---|---|
| 1+ | $157.070 |
Product Information
Product Overview
KITIM66D132HV01FLEXTOBO1 is a microphone flex evaluation kit (an evaluation system for XENSIV™ MEMS microphones). Infineon’s XENSIV™ MEMS microphone flex evaluation kit allows for evaluation with minimal effort. Its small size and flexibility enable direct placement of the flex board into a prototype. The digital flex board is equipped with a digital PDM output microphone and a 0.1µF supply bypass capacitor. It can be connected to a 6-position ZIF connector with a 0.5 mm pin spacing, such as the Molex 0527450697 or wires can be soldered directly on the flex board. The analog flex board is equipped only with the differential MEMS microphone. The adapter board has a 6-position ZIF and a 2.54 mm board-to-board connector. The adapter board provides the ability to configure the select pin of digital microphone to VDD or ground.
- Quick and easy connection to evaluation system
- Small size: 25 x 4.5mm
- Pre soldered MEMS microphone
- Configurable select pin configuration for digital microphones
Contents
5x flex boards, One adapter board.
Technical Specifications
Infineon
Audio
5 x Flex Boards IM66D132HV01, Adaptor Board
No SVHC (25-Jun-2025)
IM66D132HV01
MEMS Microphone
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Technical Docs (1)
Legislation and Environmental
RoHS
Product Compliance Certificate