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                      1. Home
                      2. Semiconductors - ICs
                      3. Memory
                      4. DRAM
                      Print Page

                      IS43TR16512BL-107MBL

                      DRAM, DDR3L, 8 Gbit, 512M x 16bit, 933 MHz, BGA, 96 Pins

                      INTEGRATED SILICON SOLUTION / ISSI IS43TR16512BL-107MBL
                      Image is for illustrative purposes only. Please refer to product description.
                      ManufacturerINTEGRATED SILICON SOLUTION / ISSI
                      Manufacturer Part NoIS43TR16512BL-107MBL
                      Newark Part No.74AC6589
                      Technical Datasheet

                      Data Sheet

                      See all Technical Docs
                      136 In Stock

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                      Product Information

                      ManufacturerINTEGRATED SILICON SOLUTION / ISSI
                      Manufacturer Part NoIS43TR16512BL-107MBL
                      Newark Part No.74AC6589
                      Technical Datasheet

                      Data Sheet

                      DRAM TypeDDR3L
                      Memory Density8Gbit
                      Memory Configuration512M x 16bit
                      Clock Frequency Max933MHz
                      IC Case / PackageBGA
                      No. of Pins96Pins
                      Supply Voltage Nom1.35V
                      IC MountingSurface Mount
                      Operating Temperature Min0°C
                      Operating Temperature Max95°C
                      Product Range-
                      MSLMSL 3 - 168 hours
                      SVHCNo SVHC (23-Jan-2024)

                      Product Overview

                      IS43TR16512BL-107MBL is a 512Mx16 1866MT/s 8Gb DDR3 SDRAM. The memory controller initiates Levelling mode of all DRAMs by setting bit 7 of MR1 to 1. When entering write levelling mode, the DQ pins are in undefined driving mode. During write levelling mode, only NOP or DESELECT commands are allowed, as well as an MRS command to exit write levelling mode. Since the controller levels one rank at a time, the output of other ranks must be disabled by setting MR1 bit A12 to 1. DRAM samples CK - CK# status with rising edge of DQS - DQS# and provides feedback on the DQ bus asynchronously after tWLO timing. In this product, all data bits ("prime DQ bit(s)") which are DQ0~DQ7 for x8, or DQ0~DQ15 for x16, provide the levelling feedback.

                      • Standard voltage is VDD and VDDQ = 1.5V ± 0.075V
                      • High-speed data transfer rates with system frequency up to 933MHz
                      • 8 internal banks for concurrent operation, 8n-bit pre-fetch architecture
                      • Programmable CAS latency, programmable additive latency: 0, CL-1, CL-2
                      • Programmable CAS WRITE latency (CWL) based on tCK, BL switch on the fly, auto self refresh (ASR)
                      • Programmable burst sequence: sequential or interleave, self refresh temperature (SRT)
                      • Partial array self refresh, asynchronous RESET pin, write levelling
                      • OCD (off-chip driver impedance adjustment), dynamic ODT (on-die termination)
                      • 96-ball BGA package
                      • Industrial temperature rating range from -40°C ≤ TC ≤ 95°C

                      Technical Specifications

                      DRAM Type

                      DDR3L

                      Memory Configuration

                      512M x 16bit

                      IC Case / Package

                      BGA

                      Supply Voltage Nom

                      1.35V

                      Operating Temperature Min

                      0°C

                      Product Range

                      -

                      SVHC

                      No SVHC (23-Jan-2024)

                      Memory Density

                      8Gbit

                      Clock Frequency Max

                      933MHz

                      No. of Pins

                      96Pins

                      IC Mounting

                      Surface Mount

                      Operating Temperature Max

                      95°C

                      MSL

                      MSL 3 - 168 hours

                      Technical Docs (1)

                      Technical Data Sheet EN

                      Legislation and Environmental

                      US ECCN:EAR99
                      EU ECCN:Unknown
                      RoHS Compliant:Yes

                      RoHS

                      RoHS Phthalates Compliant:Yes

                      RoHS

                      SVHC:No SVHC (23-Jan-2024)
                      Download Product Compliance Certificate

                      Product Compliance Certificate

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