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KA150-2AC-33X33
Thermal Chip Pad, Aluminum Oxide Ceramic, 300 mm x 300 mm x 0.16 mm, 0.49 °C/W
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No Longer Available
Product Information
Product Overview
- Eliminates mechanical clamping to heatsinks
- Cut-to-shape 300mm x 300mm sheets
- Heat curable, adhesive coated on both sides
- 0.49°C/W thermal resistance (T0-3)
- Electrically conductive aluminium foil base
- -20°C to +155°C operating temperature
- Thickness 0.14mm
- UL recognised
Technical Specifications
Thickness
0.16mm
Thermal Conductivity
-
Volume Resistivity
-
External Width
300mm
SVHC
To Be Advised
Conductive Material
Aluminium Oxide Ceramic
Thermal Impedance
0.49°C/W
External Length
300mm
Product Range
-
Technical Docs (1)
Legislation and Environmental
RoHS Compliant:To be advised
RoHS Phthalates Compliant:To be advised
SVHC:To Be Advised
Download Product Compliance Certificate
Product Compliance Certificate