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ManufacturerMICRON
Manufacturer Part NoMT62F2G64D8EK-023 AIT:B
Newark Part No.25AK8014
Technical Datasheet
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100+ | $118.370 |
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Product Information
ManufacturerMICRON
Manufacturer Part NoMT62F2G64D8EK-023 AIT:B
Newark Part No.25AK8014
Technical Datasheet
DRAM TypeLPDDR5
Memory Density128Gbit
DRAM Density128Gbit
DRAM Memory Configuration2G x 64bit
Memory Configuration2G x 64bit
Clock Frequency Max-
Clock Frequency-
IC Case / PackageFBGA
Memory Case StyleFBGA
No. of Pins-
Supply Voltage Nom-
Access Time-
IC MountingSurface Mount
Operating Temperature Min-40°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Product Overview
- Y42M mobile LPDDR5 SDRAM
- 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1)
- Single x16 channel/die, double-data-rate command/address entry
- Differential data clocks (WCK_t/WCK_c), background ZQ calibration/command-based ZQ calibration
- Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
- I/O type: low-swing single-ended, VSS terminated, VOH-compensated output drive
- Dynamic voltage frequency scaling core, single-ended CK, single-ended WCK and single-ended RDQS
- Operating voltage is 1.05V VDD2/0.5V VDDQ, automotive qualified
- 2 Gig x 64 configuration
- 441-ball TFBGA package, -40°C ≤ Tc ≤ +95°C operating temperature
Technical Specifications
DRAM Type
LPDDR5
DRAM Density
128Gbit
Memory Configuration
2G x 64bit
Clock Frequency
-
Memory Case Style
FBGA
Supply Voltage Nom
-
IC Mounting
Surface Mount
Operating Temperature Max
95°C
SVHC
No SVHC (17-Jan-2023)
Memory Density
128Gbit
DRAM Memory Configuration
2G x 64bit
Clock Frequency Max
-
IC Case / Package
FBGA
No. of Pins
-
Access Time
-
Operating Temperature Min
-40°C
Product Range
-
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (17-Jan-2023)
Download Product Compliance Certificate
Product Compliance Certificate