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MT41K256M8DA-125 IT:K
DRAM, DDR3L, 2 Gbit, 256M x 8bit, 800 MHz, FBGA, 78 Pins
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Modèle arrêté
Informations produit
FabricantMICRON
Réf. FabricantMT41K256M8DA-125 IT:KCopie
Code Commande83AH2728
Fiche technique
DRAM TypeDDR3L
DRAM Density2Gbit
Memory Density2Gbit
Memory Configuration256M x 8bit
DRAM Memory Configuration256M x 8bit
Clock Frequency800MHz
Clock Frequency Max800MHz
IC Case / PackageFBGA
Memory Case StyleFBGA
No. of Pins78Pins
Supply Voltage Nom1.35V
IC MountingSurface Mount
Access Time1.25ns
Operating Temperature Min-40°C
Operating Temperature Max95°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Aperçu du produit
- DDR3L SDRAM (32 Meg x 8 x 8 banks)
- 256 Meg x 8 configuration, tCK = 1.25ns, CL = 11 speed grade
- VDD = VDDQ = 1.35V (1.283 to 1.45V), backward-compatible to VDD = VDDQ = 1.5V ±0.075V
- Differential bidirectional data strobe, 8n-bit prefetch architecture
- Differential clock inputs (CK, CK#), 8 internal banks
- Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
- Programmable CAS (READ) latency (CL), programmable posted CAS additive latency (AL)
- Programmable CAS (WRITE) latency (CWL)
- Fixed burst length (BL) of 8 and burst chop (BC) of 4 (via the mode register set [MRS])
- 78-ball FBGA package, industrial temperature range from -40°C ≤ TC ≤ +95°C
Spécifications techniques
DRAM Type
DDR3L
Memory Density
2Gbit
DRAM Memory Configuration
256M x 8bit
Clock Frequency Max
800MHz
Memory Case Style
FBGA
Supply Voltage Nom
1.35V
Access Time
1.25ns
Operating Temperature Max
95°C
SVHC
No SVHC (17-Jan-2023)
DRAM Density
2Gbit
Memory Configuration
256M x 8bit
Clock Frequency
800MHz
IC Case / Package
FBGA
No. of Pins
78Pins
IC Mounting
Surface Mount
Operating Temperature Min
-40°C
Product Range
-
Documents techniques (2)
Législation et Questions environnementales
US ECCN:EAR99
EU ECCN:Unknown
Conforme RoHS :Oui
RoHS
Conforme à la norme RoHS Phthalates:Oui
RoHS
SVHC :No SVHC (17-Jan-2023)
Télécharger le certificat de conformité du produit
Certificat de conformité du produit