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ER2183RP250G
Potting Compound, Epoxy, Packet, Black, 250 g
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Informations produit
FabricantELECTROLUBE
Réf. FabricantER2183RP250GCopie
Code Commande97AC8986
Fiche technique
Potting Compound TypeEpoxy
Dispensing MethodPacket
Compound ColourBlack
Volume-
Weight250g
Product Range-
SVHCNo SVHC (08-Jul-2021)
Aperçu du produit
ER2183 is a thermally conductive epoxy resin with UL flame retardant approval using clean technology which results in relatively low toxicity fumes and low smoke emission. It is a low viscosity system ideal for potting and encapsulating electronics or components with limited spacing and where thermal dissipation is required. It has a wide operating temperature range and can be used in a variety of potting and encapsulation applications.
- Thermally Conductive Epoxy
- Low viscosity alternative to ER2220: 5000mPa s
- High thermal conductivity; 1.10W/m.K
- Easy to mix, uses non-abrasive fillers
- Wide operating temperature (-40°C to 130°C)
- Meets UL94 approval
- RoHS-2 Compliant
- 2.16 Relative density
Spécifications techniques
Potting Compound Type
Epoxy
Compound Colour
Black
Weight
250g
SVHC
No SVHC (08-Jul-2021)
Dispensing Method
Packet
Volume
-
Product Range
-
Documents techniques (3)
Législation et Questions environnementales
US ECCN:EAR99
EU ECCN:Unknown
Conforme RoHS :Oui
RoHS
Conforme à la norme RoHS Phthalates:Oui
RoHS
SVHC :No SVHC (08-Jul-2021)
Télécharger le certificat de conformité du produit
Certificat de conformité du produit