GC 18 SAC305T4 885V 52U

Loctite GC18 is a halogen-free, no-clean, low-voiding, Pb-free solder paste, specially formulated to provide low voiding when soldering Bottom-Terminated Components (BTC-QFN,DPAKandLGA). This material is also designed to enhance stability in printing applications.

• Low Voiding: <25% voiding across small and large BTC
• IPC Class III voiding for BGA/CSP
• Excellent soldering performance
• Good resistance to graping in demanding reflow profiles
• Excellent humidity resistance
• Minimal slump at room temperature and up to 190ºC
• Process capability: (Cpk) >2.0 for area ratios down to 0.50
• Stable on-stencil viscosity for improved printing consistency
• Reliability: Pass SIR and ECM independent of reflow profile
• Pin-testable post-reflow residues after four reflow cycles
• Compatibility with approved encapsulant technologies
• Stable at room temperature for enhanced sustainability