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Informations produit
FabricantMICRON
Réf. FabricantMT62F1G32D2DS-023 WT:BCopie
Code Commande25AK7986
Fiche technique
DRAM TypeMobile LPDDR5
Memory Density32Gbit
DRAM Density32Gbit
DRAM Memory Configuration1G x 32bit
Memory Configuration1G x 32bit
Clock Frequency4.266GHz
Clock Frequency Max4.266GHz
Memory Case StyleTFBGA
IC Case / PackageTFBGA
No. of Pins315Pins
Supply Voltage Nom1.05V
IC MountingSurface Mount
Access Time234ps
Operating Temperature Min-25°C
Operating Temperature Max85°C
Product Range-
SVHCNo SVHC (17-Jan-2023)
Aperçu du produit
MT62F1G32D2DS-023 WT:B is a mobile LPDDR5 SDRAM.
- 17.1GB/s maximum bandwidth per channel, selectable CKR (WCK:CK = 2:1 or 4:1)
- Frequency range: 1067–5MHz (data rate range per pin: 8533–40Mb/s with WCK:CK = 4:1)
- Single x16 channel/die, double-data-rate command/address entry
- Differential command clocks (CK-t/-c) for high-speed operation, differential data clocks (WCK-t/-c)
- Command-selectable burst lengths (BL = 16 or 32) in bank group or 16-bank modes
- Background ZQ calibration/command-based ZQ calibration
- Partial-array self refresh (PASR) and partial-array auto refresh (PAAR) with segment mask
- 4GB (32Gb) total density, 8533Mb/s data rate per pin
- 315-ball TFBGA package
- Operating temperature range from -25 to +85°C
Spécifications techniques
DRAM Type
Mobile LPDDR5
DRAM Density
32Gbit
Memory Configuration
1G x 32bit
Clock Frequency Max
4.266GHz
IC Case / Package
TFBGA
Supply Voltage Nom
1.05V
Access Time
234ps
Operating Temperature Max
85°C
SVHC
No SVHC (17-Jan-2023)
Memory Density
32Gbit
DRAM Memory Configuration
1G x 32bit
Clock Frequency
4.266GHz
Memory Case Style
TFBGA
No. of Pins
315Pins
IC Mounting
Surface Mount
Operating Temperature Min
-25°C
Product Range
-
Documents techniques (1)
Législation et Questions environnementales
US ECCN:EAR99
EU ECCN:Unknown
Conforme RoHS :Oui
RoHS
Conforme à la norme RoHS Phthalates:Oui
RoHS
SVHC :No SVHC (17-Jan-2023)
Télécharger le certificat de conformité du produit
Certificat de conformité du produit
