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OM13492UL
Breakout Board, 6-WLCSP, 6-TSOP, 8-TSSOP, 10-MSOP, 10-HVSON, 8-HVSON, 8U-XSON/DIP, 0.1" Pitch
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Modèle arrêté
Aperçu du produit
OM13492UL is a surface mount to DIP evaluation board. The OM13492 allows one to evaluate small, surface mount devices by breaking out the package leads to 100mil centers pins, emulating a DIP package. The OM13492 supports the following packages such as MSOP10 (SOT552-1), HVSON10 (SOT650-1), XSON8U (SOT996-2), TSSOP8 (SOT530-1), HVSON8 (SOT908-1), WLCSP6 (PCT2202UK), and TSOP6 (SOT457, SOT1353-1).
- Easy connection to small surface mount packages
- Allows evaluation of device that is only available in surface mount packages
- 100mil center headers emulate DIP package for easy bread boarding
- Eliminates costly sockets and custom printed circuit boards
- Expand the kit with add-on I2C daughter cards
- Supported devices: PCA9527DP three-channel bidirectional bus extender for HDMI, I2C-Bus and SMBus
- NVT2001_NVT2002: bidirectional voltage level translator for open-drain and push-pull applications
- PCA9537DP: 4bit I²C-bus and SMBus low-power I/O port with interrupt and reset
Spécifications techniques
Convert From
6-WLCSP, 6-TSOP, 8-TSSOP, 10-MSOP, 10-HVSON, 8-HVSON, 8U-XSON
Pitch Spacing
2.54mm
Product Range
-
Convert To
DIP
Row Pitch
-
SVHC
No SVHC (27-Jun-2024)
Documents techniques (1)
Législation et Questions environnementales
US ECCN:EAR99
EU ECCN:Unknown
Conforme RoHS :Oui
RoHS
Conforme à la norme RoHS Phthalates:Oui
RoHS
SVHC :No SVHC (27-Jun-2024)
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Certificat de conformité du produit