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LS-00019
Breadboard, Solderless, 830 Tie Points, 2 Bus Strips, 165mm x 56mm
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Disponible sur commande
Délais d’approvisionnement standard du fabricant : 3 semaine(s)
Informations produit
FabricantOSEPP
Réf. FabricantLS-00019
Code Commande11X5666
Fiche technique
Board TypeBreadboard
Breadboard TypeSolderless Breadboard
Total Number of Tie Points830Tie Points
Board MaterialPlastic
No. of Distribution Strips / Buses2Bus Strips
External Height6.5"
No. of Terminal Strips1 Terminal Strip
External Width2.2"
Board Dimensions (L x W) - Imperial6.5" x 2.2"
Board Dimensions (L x W) - Metric165mm x 56mm
SVHCTo Be Advised
Aperçu du produit
830 tie-point breadboard for prototyping and experimentation. Dimensions: 2.2" x 6.5" 1 Terminal Strip, 630 tie points 2 Distribution Strips, 200 tie points Color coordinated for easy component placement Phosphor bronze nickel plated spring clips Accepts a variety of wire sizes (20 - 29 AWG)
Spécifications techniques
Board Type
Breadboard
Total Number of Tie Points
830Tie Points
No. of Distribution Strips / Buses
2Bus Strips
No. of Terminal Strips
1 Terminal Strip
Board Dimensions (L x W) - Imperial
6.5" x 2.2"
SVHC
To Be Advised
Breadboard Type
Solderless Breadboard
Board Material
Plastic
External Height
6.5"
External Width
2.2"
Board Dimensions (L x W) - Metric
165mm x 56mm
Documents techniques (1)
Législation et Questions environnementales
US ECCN:EAR99
EU ECCN:Unknown
Conforme RoHS :À déterminer
Conforme à la norme RoHS Phthalates:À déterminer
SVHC :To Be Advised
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Certificat de conformité du produit