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CLEV6630BM
Development Kit, MFRC630/SLRC610 Plus Frontend, LPC1769 MCU, Artificial Damping
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| Quantity | Price |
|---|---|
| 1+ | $237.740 |
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$237.74
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Product Information
ManufacturerNXP
Manufacturer Part NoCLEV6630BM
Newark Part No.27AC1840
Technical Datasheet
Kit Application TypeAccess Management
Silicon ManufacturerNXP
Silicon Core NumberCLRC663 plus
Application Sub TypeNFC Frontend Development
Kit ContentsDev Kit CLRC663 plus
Product Range-
SVHCNo SVHC (27-Jun-2024)
Product Overview
The CLEV6630BM is a flexible and easy to use frontend development kit for CLRC663 plus. It contains a CLEV6630B board fully supported by the NFC Cockpit and the NFC Reader Library with a 65*65 mm2 antenna optimized for EMVCo applications and a 30 x 50mm2 antenna with matching components optimized for Access Management applications. It also includes 3 small antennas matching PCBs for implementation of custom antenna matching circuit, NFC sample cards based on NTAG216 (NFC Forum type 2 tag) and MIFARE DESFire® EV2, and 10 CLRC663 plus samples in a HVQFN package.
- Highest RF performance
- Low power card detection
- Compliance with all standards relevant to contactless NFC reader operation and EMVCo 2.6
- Artificial damping of the RF field in the middle of the antenna simulating the presence of a PCB or display to demonstrate the expected performance
- LPC1769 MCU on board, SPI interface accessible for connection of other MCU
Technical Specifications
Kit Application Type
Access Management
Silicon Core Number
CLRC663 plus
Kit Contents
Dev Kit CLRC663 plus
SVHC
No SVHC (27-Jun-2024)
Silicon Manufacturer
NXP
Application Sub Type
NFC Frontend Development
Product Range
-
Technical Docs (2)
Legislation and Environmental
US ECCN:5A992
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (27-Jun-2024)
Download Product Compliance Certificate
Product Compliance Certificate