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HSP-3
THERMAL TRANSFER PAD
Image is for illustrative purposes only. Please refer to product description.
ManufacturerSENSATA/CRYDOM
Manufacturer Part NoHSP-3
Newark Part No.71T7032
Product RangeHEAT SINKS HS Series
Technical Datasheet
No Longer Available
Product Information
ManufacturerSENSATA/CRYDOM
Manufacturer Part NoHSP-3
Newark Part No.71T7032
Product RangeHEAT SINKS HS Series
Technical Datasheet
Thickness0.076mm
Conductive Material-
Thermal Conductivity1W/m.K
Thermal Impedance-
Volume Resistivity-
External Length103.9mm
External Width73.7mm
Product RangeHEAT SINKS HS Series
SVHCNo SVHC (12-Jan-2017)
Technical Specifications
Thickness
0.076mm
Thermal Conductivity
1W/m.K
Volume Resistivity
-
External Width
73.7mm
SVHC
No SVHC (12-Jan-2017)
Conductive Material
-
Thermal Impedance
-
External Length
103.9mm
Product Range
HEAT SINKS HS Series
Technical Docs (1)
Legislation and Environmental
US ECCN:EAR99
EU ECCN:Unknown
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (12-Jan-2017)
Download Product Compliance Certificate
Product Compliance Certificate