4870-18G

4870-18G is a electronic grade solder wire. It uses a tin-to-lead alloy ratio, with a no-clean, synthetically refined, splatter-proof resin flux core. It melt at a higher and wider temperature range than 63/37 solder. They create robust and reliable joints that are highly resistant to whisker formation. This leaded solders achieve a consistent solder and flux percentage thanks to our state-of the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

• 21 gauge, 0.032inch diameter
• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B for ROM1, particle size Type 3, good wettability
• Excellent 12 mil fine pitch printing capability, long operational life non-slumping
• REL0 flux classification, resin flux type, low flux activity
• Corrosion test, electromigration, silver chromate–Cl–+ Br–, flux residue dryness
• Softening point of flux extract is 24°C, splitting of flux–cored wire solder is 0.30%
• Post reflow flux residue is 45%, pocket package